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Precision Machining:

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CiDRA Precision Services offers a suite of high precision machining services. Services include:
Precision and Ultra- Precision Centerless Grinding Ultra-Precision Slicing, Dicing and Singulation High Speed CNC Milling & Drilling Center Flat Polishing Glass Laser Fusing Micro-Hole Drilling	Back Grinding Back Lapping Wafer Grinding Wafer Thinning Wafer back grinding Micro Chip Dicing

Precision Grinding Equipment High Precision Centerless Grinding Machines Grinding Capability - Plunge grind; concentric grind; through feed grind. Agathon 150-SL CNC Workpiece length up to 250 mm Workpiece diameter from .1 to 10 mm Smallest adjustment .0001 mm Repeatability .0005 Agathon 150-SL CNC Fitted with Custom AGT CNC Crush Dressing Units Dressing Accuracies of + .001 mm per feature General E226 Truing Machine with Vision Scope for Dressing Bonded Diamond Wheels

Precision Slicing Equipment CNC 4 Axis State of the Art Slicing Machinery MTI NSS-612 4 Axis Nano Slicing System with MTI Video System
	Effective work table travel: X axis 305 mm (12 in) Y axis 152 mm (6 in) Z axis 76 mm (3 in) Resolution: X (feed) 0.100 µm (4.0 µ in) Y (index) 0.100 µm (4.0 µ in) Z (vertical) 0.100 µm (4.0 µ in)

4th Axis Indexing Accuracy: Y (axis) + 0.250 µm (+ 10.0 µ in) Straightness of Feed: X (axis) 0.05 µm/25 mm (2.0 µ in/in) Spindle Cartridge Accuracies: True centerline run-out of taper .05 µm (20 µ in) True axial run-out of taper 0.5 µm (20 µ in) MTI NSS-816 4 Axis Nano Slicing System with MTI Video System

Precision Polishing Equipment High Precision Flat Polishing Machines Strasbaugh Two Spindle Polishing Machine Model 6DA-DC-2 Capacity: 12" Ø x 8" length Capability: .003 Ra Strasbaugh One Spindle Polishing Machine Model 6DA-DC-2 Capacity: 12" Ø x 8" length Capability: .003 Ra

High Speed CNC Milling & Drilling Center Fanuc Robodrill T14iBL Effective work table travel: X axis 700mm Y axis 400mm Z axis 330mm Spindle 120 - 15,000 RPM Feedrate 1 - 15,000mm/min Rapid Travel 1890 IPM 1.2G Acceleration Turret Tool change system - spindle independent from turret Type of tooling - BT30 Tool storage capacity - 14 tools Tool changing time - 1.8 sec. chip to chip Accuracy Single direction positioning accuracy: 0.006/300mm Positioning repeatability - +/- 0.002mm

Ultra Precision Surface Grinder Okamoto VG101MKIIL Wafer Size: 4", 5", 6", 8" Continuous downfeed grinding method Work table and spindle air bearing spindle speed: 1 - 3600 rpm infeed rate: 1 - 999 um/min vacuum chuck speed: 1 - 999 rpm Automatic sizing device 2 point in-process gauge system min. resolution: 1 um max. range: 999 um (1999 um by offset base) Grinding Accuracy Thickness Variation (WTW) - without tape 4": Less than 0.5 um 6": Less than 0.5 um 8": Less than 1.0 um Total Thickness Variation (TTV) - without tape 4": Less than 0.5 um 6": Less than 0.7 um 8": Less than 1.0 um Surface Finish Less than 0.2 um Rmax.

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